Versamid® 150 is a low viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins to provide tough, chemical resistance to thermoset coating and potting applications that cure at room temperature.
Key Features and Benefits:
- Excellent resistant properties
- Fast cure rate
Chemical Composition: Polyamide resin based on dimerized fatty acid and polyamines
Versamid® 150 is a low viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins to provide tough, chemical resistance to thermoset coating and potting applications that cure at room temperature. Versamid® 150 and epoxy resin systems offer significantly lower viscosity than Versamid® 140 systems, while its chemical and solvent resistance, flexural strength and compressive strength properties are similar. Versamid® 150 systems will normally provide a faster cure rate and slightly less flexibility than Versamid® 140 systems. Versamid® 150 and epoxy resin systems are recommended for applications such as industrial maintenance surface coating applications, primers, encapsulating potting and laminating applications, low viscosity, thermoset adhesive formulations.
TSCA (USA), DSL (Canada), PICCS (Philippines), AICS (Australia), ENCS/MITI (Japan), IECSC (China), EINECS (EU)
Package, Storage, Handling:
Versamid® 100 X 65 may absorb moisture and carbon dioxide if left in open containers, which may result in an increased viscosity and some foaming when curing epoxy resins. Therefore, it should be kept in tightly closed containers when not in use and stored in a cool, dry place. Properly stored and protected, an unopened container of Versamid® 100 X 65 should have a shelf life of at least one year.
For Specifications, Typical Properties, and Processing please see technical data sheet.