Applications Guide for Adhesives: Features, Technology, & Chemistry Type

In adhesives applications, Gabriel Phenoxy Resins offer a wide selection for your chosen technology. Phenoxy Resins are used to add superior adhesion promotion to a wide variety of substrates. The large number of secondary hydroxyls give Phenoxy the “bite” that many systems require. The linear thermoplastic nature of Phenoxy provides flexibility to rigid crosslinked systems. Phenoxy resins find use in aerospace and automotive latent cure and hotmelt adhesives by improving adhesion and flexibility of epoxy-based compounds, and circuit board laminating adhesives by increasing bond strength to the boards. Applications include:

  • Solventborne
  • Waterborne – Air dry and thermoset
  • Hot melt
  • High solids – Thermoset and Air-dry 2K

 

APPLICATIONS GUIDE FOR ADHESIVES: CHEMISTRY & TECHNOLOGY

Chemistry Solventborne Waterborne Powder High Solids
Epoxy/Amine 2K Ambient PKHS-40  

 

Epoxy/X-Linker 1K Latent PKHB-100
LER-HB
Polyester/NCO 2K Ambient PKHS-30PMA PKHM-85
Polyester/NCO 1K Blocked PKHS-30PMA PKHW-34 PKHB PKHM-85
Melamine Thermoset PKHS-40 PKHW-35
PKHW-34
PKHM-85
Phenolic Thermoset PKHS-40 PKHW-35
PKHW-34
PKHM-85
Epoxy Cationic
EVAH Hotmelt PKHM-301 PKHB
PKHB-100
TPU

hotmelt